Bold People.
Bright Ideas.

We are looking for a Chip Test Engineer with deep expertise in RF, digital, and analog/mixed-signal testing to lead the development of test solutions from initial silicon bring-up through high-volume production.

This role is critical in bridging R&D and manufacturing, taking early proof-of-concept validation setups and scaling them into robust wafer-level and ATE production test solutions for our advanced sensor ICs used in ADAS and autonomous driving applications.

Location: Seaport, Boston, MA

What You’ll Do

• Lead initial silicon bring-up and bench validation for new ICs, including debugging and characterization of first silicon.
• Develop proof-of-concept (PoC) test setups using lab equipment and translate these into scalable production test methodologies.
• Design and implement production test solutions at:
  • Wafer level (probe)
  • ATE platforms (e.g., Teradyne, Advantest)
• Own the full lifecycle of test development: bench → characterization → correlation → production release.
• Develop and optimize test programs, scripts, and automation using C++, Python, or similar tools.
• Work closely with design (RF, analog, digital), systems, and product engineering teams to define test coverage and ensure alignment with specifications.
• Perform correlation between bench measurements and ATE results, ensuring accuracy and repeatability.
• Characterize and validate performance of:
  • RF circuits
  • ADCs
  • DSP blocks
  • Mixed-signal subsystems
• Support testing of multi-chip module (MCM) packages, including system-level validation considerations.
• Analyze test data to identify yield issues, parametric shifts, and failure modes using tools like JMP, Spotfire, or similar.
• Drive test time reduction, yield improvement, and cost optimization in production.
• Collaborate with OSATs and test vendors to deploy and qualify test solutions in manufacturing.

What You Bring

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
• 5+ years of experience in semiconductor test engineering, with strong product engineering exposure.
• Proven experience across:
  • Bench testing and silicon bring-up
  • Test development and characterization
  • Production test implementation (wafer probe + ATE)
• Strong hands-on experience with:
  • RF test methods (e.g., spectrum analysis, signal generation)
  • Analog and mixed-signal validation
  • High-speed digital testing
• Familiarity with testing:
  • RF circuits
  • ADCs
  • DSP-based systems
• Experience working with multi-chip module (MCM) packages is highly desirable.
• Proficiency in ATE platforms such as Teradyne or Advantest.
• Strong programming skills in Python, C++, or similar for automation and data analysis.
• Hands-on experience with lab equipment such as:
  • Oscilloscopes
  • Spectrum analyzers
  • Signal generators
  • Network analyzers
• Strong understanding of correlation between lab and production environments.
• Excellent debugging, analytical, and problem-solving skills.

Bonus Points

• Experience with mmWave or RFIC-based systems.
• Background in automotive semiconductor products (ADAS/AV).
• Experience working closely with OSATs for test transfer and yield ramp.

Prior experience in a startup or fast-paced product development environment.

Responsibilities

• Technical leadership, guiding the design and execution of advanced IC packages for multi-chip RFIC/SoC integration.
• Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions.
• Work on single-sided and double-sided RDL designs and on-package RF antenna structures.
• Co-optimize package designs for signal integrity, power integrity, thermal, and mechanical performance in collaboration with RFIC, digital, and system engineers.
• Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q).
• Perform stress, warpage, and thermal simulations using tools such as ANSYS.
• Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development.
• Create and review electrical performance analysis (signal path length, PDN, crosstalk/noise etc.), mechanical analysis and drawings, stack-ups, and layout constraints.
• Lead failure analysis and root cause investigations for packaging and reliability issues and provide solutions to increase yield.
• Contribute to the packaging roadmap and scalability plan for automotive volume production.

Key Qualifications

• 10+ years of experience in IC packaging design and development, including leadership responsibilities.
• Proven track record with multi-chip packages, digital + RF integration, and automotive applications.
• Deep knowledge of UCIe interconnects, organic substrates, interposers, and advanced packaging architectures.
• Experience with RF antenna integration in package designs.
• Proficient in Flip-Chip, Fan-Out, 2.5D integration, and heterogeneous system-in-package solutions.
• Strong understanding of packaging electrical performance such as signal and power integrity, mechanical stress, thermal management, and reliability analysis.
• Established network with packaging vendors and OSATs.
• M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
• Excellent communication skills and ability to thrive in a fast-paced start-up environment.

Why Join

• Technical oversight, defining packaging solutions for breakthrough ADAS technology.
• Collaborate with a world-class engineering team spanning RFIC, SoC, and system design.
• Be part of a well-funded start-up bringing innovative sensing technology to market.
• Competitive compensation, stock options, and flexible work arrangements.

Location

Hybrid work from one of our offices:

• Bay Area, CA
• Boston, MA

Teradar is seeking a driven and organized RF Systems Engineer with a background in radar systems, RF, or electromagnetics to help bring the world’s first THz phased array imaging system to market.

You’ll work cross-functionally with IC design, antenna/array, signal processing, PCB, packaging, and software teams to support system integration, testing, and characterization of internally developed mmWave ICs. You’ll also play a key role in improving performance, measurement techniques, and scaling system testing.

Most days will involve hands-on debugging and OTA testing of chips and subsystems; others will focus on developing new calibration and test methods and driving implementation logistics. Your work will be central to the technical success and scale-up of the company’s next-gen radar platform.

What You Will Do

• Perform system integration and bring up new versions of the radar system
• Develop and implement new measurement and calibration methods for the radar system
• Develop processes and automation for characterizing a high volume of systems across
• process and temperature corners.
• Solve or participate in solving customer facing system capability improvements
• Manage hardware responsibilities for phased array characterization and analog
• beamforming
• Debug issues with system performance.
• Characterize chipsets over the air using VNAs, spectrum analyzers and frequency extender modules

What You Will Bring 

• Advanced experience with phased array radars
• Experience working at a start-up or high-growth oriented company
• Eager to learn new material, especially related to RF test methods as well as RF system
• design and integration.
• Experience doing over the characterization of antennas and beamforming networks
• System and device level understanding of amplifiers, mixers, phase shifters and other RF components.
• Experience using VNAs, spectrum analyzers and other high frequency lab equipment.
• Strong attention to detail, project/time management, and organizational skills

Location
Boston MA (onsite)

If your jam is low-level programming, high-performance DSPs, and working close to the metal, this one’s for you.

What You Will Do 

• Profile, analyze, and optimize performance, power, and area trade-offs in software designs.
• Develop and optimize embedded software for high-performance multicore DSP platforms.
• Leverage SIMD, VLIW, and fractional arithmetic techniques to deliver efficient signal processing and linear algebra algorithms.
• Work closely with hardware design teams to understand instruction set architectures (ISA) and micro-architectures details, ensuring software takes full advantage of the hardware.
• Integrate DMA strategies to maximize data throughput.
• Build, use, and maintain pre-silicon validation platforms such such as virtual prototypes for early software development and testing.

What You Will Bring

• Strong experience programming for embedded processors or low-level systems.
• Solid understanding of computer architecture and micro-architecture fundamentals.
• Hands-on experience with SIMD and VLIW programming models.
• Knowledge of DMA integration in embedded systems.
• Familiarity with fractional arithmetic in DSP applications.
• Experience working with instruction set architecture (ISA) documentation or development.
• Exposure to virtual prototypes or pre-silicon validation platforms.
• Proficiency in C/C++, Assembly, Intrinsics
• Ability to analyze performance bottlenecks and optimize for PPA.

Bonus Points 

• Individuals who have worked with CEVA DSPs, particularly the SensePro family (SP500/SP1000) and MRD accelerators, will be exceptionally well-suited for this role.
• Familiarity with CEVA’s instruction set, toolchains, and performance optimization techniques will be highly advantageous, especially in the context of high-performance signal processing for sensing applications.

Location
Boston MA (hybrid)